Classification | Test ltem | Reference Standard | Test Conditions | Result |
Endurance Test | Operation Life | MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021:B-1 | Connect with a power If:20mA Ta=Under room temperature Test time=1000hrs | 0/20 |
High Temperature High Humidiyt storage | MIL-STD-202:103B JIS-C-7021:B-11 | Ta=+65℃±5℃ RH=90%-95% Test time=240hrs | 0/20 | |
High Temperature Storage | MIL-STD-883:1008 JIS-C-7021:B-10 | High Ta=+85℃±5℃ Test time=1000hrs | 0/20 | |
Low Temperature Storage | JIS-C-7021:B-12 | Low Ta=-35℃±5℃ Test time=1000hrs | 0/20 | |
Environmental Test | Temperature Cycling | MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021:A-4 | -35℃～+25℃～+85℃～+25℃ 60min 20min 60min 20min Test Time=5cycle | 0/20 |
Thermal Shock | MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1011 | -35℃±5℃ ～ +85℃±5℃ 20min 20min Test Time=10cycle | 0/20 | |
Solder Resistance | MIL-STD-202F:210AMIL-STD-750D:203 JIS C 7021:A-1 | T.sol=260±5℃ Dwell Time=10±1secs | 0/20 | |
IR-Reflow Pb Free proces | MIL-STD-750D:2032 J-STD-020D | Ramp-up rate(217℃ to Peak)+3℃/second max Temp.maintain at 175(±25)℃ 180 seconds max Temp.maintain above 217℃ 60-150 seconds Peak temperature range 260℃+0/-5℃ Time within 5℃ of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate+6℃/second max | 0/20 | |
Solderability | MIL-STD-202F:208D MIL-STD-750D:2026 MIL-STD-883D:2003 IEC 68 Part 2-20 JIS C 7021:A-2 | T.sol=235±5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage≥95% of the dipped surface | 0/20 |
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